| Anzahl | Privatkunde |
|---|---|
| 1+ | 6.18 EUR |
| 100+ | 5.21 EUR |
| 500+ | 4.4 EUR |
| 1350+ | 4.05 EUR |
| 2700+ | 4.02 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details CLP-110-02-G-D-K-TR Samtec
Description: CONN RCPT 20POS 0.05 GOLD SMD, Features: Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Gold, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote CLP-110-02-G-D-K-TR nach Preis ab 4.74 EUR bis 7.28 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CLP-110-02-G-D-K-TR | Samtec Inc. |
 Description: CONN RCPT 20POS 0.05 GOLD SMDFeatures: Pick and Place Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
auf Bestellung 1820 Stücke: Lieferzeit 10-14 Tag (e) |
|
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 |
CLP-110-02-G-D-K-TR | SAMTEC |
Description: SAMTEC - CLP-110-02-G-D-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbindermontage: Oberflächenmontage Anzahl der Kontakte: 20Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board productTraceability: No usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm |
auf Bestellung 20 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| CLP-110-02-G-D-K-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 20POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 20POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
auf Bestellung 1820 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.28 EUR |
| 25+ | 6.82 EUR |
| 50+ | 6.26 EUR |
| 100+ | 5.49 EUR |
| 500+ | 4.74 EUR |
| CLP-110-02-G-D-K-TR |
|
Hersteller: SAMTEC
Description: SAMTEC - CLP-110-02-G-D-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 20Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
productTraceability: No
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
Description: SAMTEC - CLP-110-02-G-D-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 20Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
productTraceability: No
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
auf Bestellung 20 Stücke:
Lieferzeit 14-21 Tag (e)