
auf Bestellung 1125 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 7.39 EUR |
25+ | 6.90 EUR |
50+ | 6.35 EUR |
100+ | 5.56 EUR |
500+ | 4.68 EUR |
1175+ | 3.91 EUR |
4700+ | 3.80 EUR |
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Technische Details CLP-111-02-F-DH-TR Samtec
Description: CONN RCPT 22P 0.05 GOLD SMD R/A, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 22, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Insulation Height: 0.135" (3.43mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote CLP-111-02-F-DH-TR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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CLP-111-02-F-DH-TR | Hersteller : Samtec Inc. |
![]() Packaging: Tape & Reel (TR) Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 22 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.135" (3.43mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
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