CLP-115-02-L-D Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 11.3 EUR |
| 10+ | 8.96 EUR |
| 116+ | 8.01 EUR |
| 261+ | 7.52 EUR |
| 1015+ | 7.5 EUR |
| 2523+ | 7.22 EUR |
| 5017+ | 7.08 EUR |
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Technische Details CLP-115-02-L-D Samtec
Description: CONN RCPT 30POS 0.05 GOLD SMD, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 30, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Bulk, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.090" (2.29mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder.
Weitere Produktangebote CLP-115-02-L-D nach Preis ab 8.6 EUR bis 12.13 EUR
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CLP-115-02-L-D | Hersteller : Samtec Inc. |
 Description: CONN RCPT 30POS 0.05 GOLD SMDNumber of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 30 Mounting Type: Surface Mount Current Rating (Amps): 3.3A per Contact Voltage Rating: 240VAC, 330VDC Connector Type: Receptacle Packaging: Bulk Number of Rows: 2 Row Spacing - Mating: 0.050" (1.27mm) Insulation Height: 0.090" (2.29mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder |
auf Bestellung 406 Stücke: Lieferzeit 10-14 Tag (e) |
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