Produkte > SAMTEC INC. > CLP-119-02-F-DH

CLP-119-02-F-DH Samtec Inc.


clp_sm.pdf
Hersteller: Samtec Inc.
Description: CONN RCPT 38P 0.05 GOLD SMD R/A
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 38
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Packaging: Tube
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.135" (3.43mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+18.15 EUR
10+16.34 EUR
100+14.6 EUR
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Technische Details CLP-119-02-F-DH Samtec Inc.

Description: CONN RCPT 38P 0.05 GOLD SMD R/A, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 38, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Tube, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.135" (3.43mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0.

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CLP-119-02-F-DH CLP-119-02-F-DH Samtec clp_sm-2758206.pdf Headers & Wire Housings Low Profile Dual-Wipe Socket, 0.050 Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
CLP-119-02-F-DH clp_sm-2758206.pdf
Hersteller: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket, 0.050 Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH