CPF0805B26R1E1 TE Connectivity Passive Product
Hersteller: TE Connectivity Passive ProductDescription: RES SMD 26.1 OHM 0.1% 1/10W 0805
Packaging: Cut Tape (CT)
Power (Watts): 0.1W, 1/10W
Tolerance: ±0.1%
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0805
Height - Seated (Max): 0.026" (0.65mm)
Resistance: 26.1 Ohms
auf Bestellung 830 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 42+ | 0.42 EUR |
| 51+ | 0.35 EUR |
| 58+ | 0.31 EUR |
| 100+ | 0.29 EUR |
| 500+ | 0.25 EUR |
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Technische Details CPF0805B26R1E1 TE Connectivity Passive Product
Description: RES SMD 26.1 OHM 0.1% 1/10W 0805, Packaging: Tape & Reel (TR), Power (Watts): 0.1W, 1/10W, Tolerance: ±0.1%, Package / Case: 0805 (2012 Metric), Temperature Coefficient: ±25ppm/°C, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Composition: Thin Film, Operating Temperature: -55°C ~ 155°C, Number of Terminations: 2, Supplier Device Package: 0805, Height - Seated (Max): 0.026" (0.65mm), Resistance: 26.1 Ohms.
Weitere Produktangebote CPF0805B26R1E1
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CPF0805B26R1E1 | Hersteller : TE Connectivity Passive Product |
Description: RES SMD 26.1 OHM 0.1% 1/10W 0805 Packaging: Tape & Reel (TR) Power (Watts): 0.1W, 1/10W Tolerance: ±0.1% Package / Case: 0805 (2012 Metric) Temperature Coefficient: ±25ppm/°C Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Composition: Thin Film Operating Temperature: -55°C ~ 155°C Number of Terminations: 2 Supplier Device Package: 0805 Height - Seated (Max): 0.026" (0.65mm) Resistance: 26.1 Ohms |
Produkt ist nicht verfügbar |
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CPF0805B26R1E1 | Hersteller : TE Connectivity / Holsworthy |
Thin Film Resistors - SMD CPF 0805 26R1% 0.1% 25PPM |
Produkt ist nicht verfügbar |