CYPD3195-24LDXST Infineon Technologies
Hersteller: Infineon TechnologiesDescription: CCG3PA
Packaging: Tape & Reel (TR)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: I2C, SPI, UART, USB
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3V ~ 24.5V
Program Memory Type: FLASH (64kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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Technische Details CYPD3195-24LDXST Infineon Technologies
Description: CCG3PA, Packaging: Tape & Reel (TR), Package / Case: 24-UFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Interface: I2C, SPI, UART, USB, RAM Size: 8K x 8, Operating Temperature: -40°C ~ 105°C, Voltage - Supply: 3V ~ 24.5V, Program Memory Type: FLASH (64kB), Applications: USB Type C, Core Processor: ARM® Cortex®-M0, Supplier Device Package: 24-QFN (4x4), Part Status: Active, Number of I/O: 12, DigiKey Programmable: Not Verified.