CYT3DLBBCBQ1BZSGS Infineon Technologies
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 61.39 EUR |
| 10+ | 54.79 EUR |
| 25+ | 52.34 EUR |
| 50+ | 52.32 EUR |
| 100+ | 46.78 EUR |
| 250+ | 44.65 EUR |
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Technische Details CYT3DLBBCBQ1BZSGS Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH, Packaging: Tray, Package / Case: 272-LFBGA, Mounting Type: Surface Mount, Speed: 100MHz, 240MHz, Program Memory Size: 4.06MB (4.06M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, Data Converters: A/D 48x12b SAR, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Supplier Device Package: 272-BGA (16x16), Number of I/O: 135.
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CYT3DLBBCBQ1BZSGS | Hersteller : Infineon Technologies |
 Description: TRAVEO-2 CLUST.2.5DGRAPHPackaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 100MHz, 240MHz Program Memory Size: 4.06MB (4.06M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Data Converters: A/D 48x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Supplier Device Package: 272-BGA (16x16) Number of I/O: 135 |
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