CYT4DNJBLCQ1BZSGS Infineon Technologies
| Anzahl | Preis |
|---|---|
| 1+ | 62.46 EUR |
| 10+ | 53.43 EUR |
| 25+ | 51.18 EUR |
| 100+ | 46.39 EUR |
| 250+ | 44.81 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details CYT4DNJBLCQ1BZSGS Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH, Mounting Type: Surface Mount, Package / Case: 327-LFBGA, Packaging: Tray, Number of I/O: 168, Supplier Device Package: 327-FBGA (17x17), Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Core Size: 32-Bit Tri-Core, Data Converters: A/D 48x12b SAR, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, EEPROM Size: 128K x 8, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 640K x 8, Program Memory Size: 6.19MB (6.19M x 8), Speed: 100MHz, 320MHz.
Weitere Produktangebote CYT4DNJBLCQ1BZSGS
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
|
CYT4DNJBLCQ1BZSGS | Infineon Technologies |
Description: TRAVEO-2 CLUST.2.5DGRAPHMounting Type: Surface Mount Package / Case: 327-LFBGA Packaging: Tray Number of I/O: 168 Supplier Device Package: 327-FBGA (17x17) Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 48x12b SAR Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 640K x 8 Program Memory Size: 6.19MB (6.19M x 8) Speed: 100MHz, 320MHz |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 900 Stücke Im Einkaufswagen Stück im Wert von UAH |
| CYT4DNJBLCQ1BZSGS |
![]() |
Hersteller: Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tray
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Description: TRAVEO-2 CLUST.2.5DGRAPH
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tray
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
Im Einkaufswagen
Stück im Wert von UAH



