| Anzahl | Preis |
|---|---|
| 1+ | 9.61 EUR |
| 10+ | 8.17 EUR |
| 100+ | 6.85 EUR |
| 250+ | 6.83 EUR |
| 500+ | 6.21 EUR |
| 1000+ | 5.91 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details D01-9952042 Harwin
Description: CONN SOCKET SIP 20POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Brass.
Weitere Produktangebote D01-9952042 nach Preis ab 5.95 EUR bis 9.7 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
D01-9952042 | Harwin Inc. |
 Description: CONN SOCKET SIP 20POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
auf Bestellung 1715 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
 |
D01-9952042 | HARWIN |
Description: HARWIN - D01-9952042 - IC- & Baustein-Sockel, 20 Kontakt(e), SIP-Buchse, 2.54 mm, D01, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 20Kontakt(e) Steckverbinder: SIP-Buchse euEccn: NLR isCanonical: Y Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: - rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: D01 SVHC: Lead (04-Feb-2026) |
auf Bestellung 675 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| D01-9952042 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 20POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 20POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
auf Bestellung 1715 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.7 EUR |
| 10+ | 8.24 EUR |
| 125+ | 6.89 EUR |
| 500+ | 6.25 EUR |
| 1000+ | 5.95 EUR |
| D01-9952042 |
|
Hersteller: HARWIN
Description: HARWIN - D01-9952042 - IC- & Baustein-Sockel, 20 Kontakt(e), SIP-Buchse, 2.54 mm, D01, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 20Kontakt(e)
Steckverbinder: SIP-Buchse
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: -
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: D01
SVHC: Lead (04-Feb-2026)
Description: HARWIN - D01-9952042 - IC- & Baustein-Sockel, 20 Kontakt(e), SIP-Buchse, 2.54 mm, D01, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 20Kontakt(e)
Steckverbinder: SIP-Buchse
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: -
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: D01
SVHC: Lead (04-Feb-2026)
auf Bestellung 675 Stücke:
Lieferzeit 14-21 Tag (e)