D01-9970942 Harwin
| Anzahl | Privatkunde |
|---|---|
| 136+ | 1.3 EUR |
| 250+ | 1.23 EUR |
| 500+ | 1.15 EUR |
| 1000+ | 1.09 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details D01-9970942 Harwin
Description: CONN SOCKET SIP 9POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 9 (1 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Brass.
Weitere Produktangebote D01-9970942 nach Preis ab 1.23 EUR bis 2.75 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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D01-9970942 | Harwin |
 IC & Component Sockets D01 9 WAY SIL HORIZ SMT HDR T&R (600) |
auf Bestellung 7171 Stücke: Lieferzeit 10-14 Tag (e) |
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D01-9970942 | Harwin Inc. |
Description: CONN SOCKET SIP 9POS GOLD Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
auf Bestellung 1109 Stücke: Lieferzeit 10-14 Tag (e) |
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D01-9970942 | HARWIN |
Description: HARWIN - D01-9970942 - IC- & Baustein-Sockel, 9 Kontakt(e), SIP-Buchse, 2.54 mm, D01, Berylliumkupfer tariffCode: 85366930 productTraceability: Yes-Date/Lot Code Kontaktüberzug: Hauchvergoldete Kontakte rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 9Kontakt(e) Steckverbinder: SIP-Buchse euEccn: NLR isCanonical: Y Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: - rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: D01 SVHC: Lead (04-Feb-2026) |
auf Bestellung 512 Stücke: Lieferzeit 14-21 Tag (e) |
|
| D01-9970942 |
|
Hersteller: Harwin
IC & Component Sockets D01 9 WAY SIL HORIZ SMT HDR T&R (600)
IC & Component Sockets D01 9 WAY SIL HORIZ SMT HDR T&R (600)
auf Bestellung 7171 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.07 EUR |
| 10+ | 1.76 EUR |
| 25+ | 1.75 EUR |
| 100+ | 1.49 EUR |
| 500+ | 1.33 EUR |
| 1200+ | 1.23 EUR |
| D01-9970942 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 9POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 9POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
auf Bestellung 1109 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.12 EUR |
| 12+ | 1.78 EUR |
| 100+ | 1.52 EUR |
| 500+ | 1.36 EUR |
| D01-9970942 |
|
Hersteller: HARWIN
Description: HARWIN - D01-9970942 - IC- & Baustein-Sockel, 9 Kontakt(e), SIP-Buchse, 2.54 mm, D01, Berylliumkupfer
tariffCode: 85366930
productTraceability: Yes-Date/Lot Code
Kontaktüberzug: Hauchvergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 9Kontakt(e)
Steckverbinder: SIP-Buchse
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: -
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: D01
SVHC: Lead (04-Feb-2026)
Description: HARWIN - D01-9970942 - IC- & Baustein-Sockel, 9 Kontakt(e), SIP-Buchse, 2.54 mm, D01, Berylliumkupfer
tariffCode: 85366930
productTraceability: Yes-Date/Lot Code
Kontaktüberzug: Hauchvergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 9Kontakt(e)
Steckverbinder: SIP-Buchse
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: -
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: D01
SVHC: Lead (04-Feb-2026)
auf Bestellung 512 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 91+ | 2.75 EUR |
| 114+ | 2.05 EUR |
| 145+ | 1.48 EUR |
| 500+ | 1.32 EUR |