| Anzahl | Privatkunde |
|---|---|
| 1+ | 8.71 EUR |
| 10+ | 7.39 EUR |
| 26+ | 6.91 EUR |
| 52+ | 6.58 EUR |
| 104+ | 6.26 EUR |
| 260+ | 5.9 EUR |
| 520+ | 5.65 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details D0816-42 Harwin
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote D0816-42 nach Preis ab 6.45 EUR bis 11.67 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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D0816-42 | Harwin Inc. |
 Description: CONN IC DIP SOCKET 16POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 173 Stücke: Lieferzeit 10-14 Tag (e) |
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D0816-42 | HARWIN |
Description: HARWIN - D0816-42 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, D08, 7.62 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: Y-EX Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 16Kontakt(e) SVHC: Lead (04-Feb-2026) Reihenabstand: 7.62mm Steckverbinder: DIP Produktpalette: D08 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 1510 Stücke: Lieferzeit 14-21 Tag (e) |
|
| D0816-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 173 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.01 EUR |
| 10+ | 7.64 EUR |
| 26+ | 7.14 EUR |
| 52+ | 6.81 EUR |
| 104+ | 6.47 EUR |
| D0816-42 |
|
Hersteller: HARWIN
Description: HARWIN - D0816-42 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, D08, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 16Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP
Produktpalette: D08
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: HARWIN - D0816-42 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, D08, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 16Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP
Produktpalette: D08
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 1510 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 22+ | 11.67 EUR |
| 29+ | 8.26 EUR |
| 100+ | 6.77 EUR |
| 250+ | 6.45 EUR |