D10650-40 Wakefield Thermal
Hersteller: Wakefield Thermal
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; L: 16.5mm; W: 16.5mm; H: 10.2mm
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Length: 16.5mm
Width: 16.5mm
Height: 10.2mm
Base thickness: 2.5mm
Manufacturer series: DELTEM
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Technische Details D10650-40 Wakefield Thermal
Description: HEATSINK 100PQFP COMPOSITE, Packaging: Tube, Material: Composite, Length: 0.650" (16.51mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.650" (16.51mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Not Included), Power Dissipation @ Temperature Rise: 2.0W @ 40°C, Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 350 LFM, Fin Height: 0.400" (10.16mm), Part Status: Active.
Weitere Produktangebote D10650-40 nach Preis ab 6.25 EUR bis 13.95 EUR
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D10650-40 | Wakefield Thermal Solutions |
Description: HEATSINK 100PQFP COMPOSITE Packaging: Tube Material: Composite Length: 0.650" (16.51mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.650" (16.51mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included) Power Dissipation @ Temperature Rise: 2.0W @ 40°C Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 350 LFM Fin Height: 0.400" (10.16mm) Part Status: Active |
auf Bestellung 1993 Stücke: Lieferzeit 10-14 Tag (e) |
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D10650-40 | Wakefield Thermal Solutions, Inc. |
Heat Sink Passive BGA Pin Array Adhesive |
auf Bestellung 64 Stücke: Lieferzeit 14-21 Tag (e) |
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| D10650-40 | Wakefield-Vette, Inc |
Heat Sink Passive BGA Pin Array Adhesive |
auf Bestellung 1140 Stücke: Lieferzeit 14-21 Tag (e) |
|
| D10650-40 |
|
Hersteller: Wakefield Thermal Solutions
Description: HEATSINK 100PQFP COMPOSITE
Packaging: Tube
Material: Composite
Length: 0.650" (16.51mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.650" (16.51mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 350 LFM
Fin Height: 0.400" (10.16mm)
Part Status: Active
Description: HEATSINK 100PQFP COMPOSITE
Packaging: Tube
Material: Composite
Length: 0.650" (16.51mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.650" (16.51mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 350 LFM
Fin Height: 0.400" (10.16mm)
Part Status: Active
auf Bestellung 1993 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.03 EUR |
| 10+ | 7.98 EUR |
| 26+ | 7.59 EUR |
| 52+ | 7.32 EUR |
| 104+ | 7.06 EUR |
| 260+ | 6.72 EUR |
| 520+ | 6.47 EUR |
| 1014+ | 6.25 EUR |
| D10650-40 |
|
Hersteller: Wakefield Thermal Solutions, Inc.
Heat Sink Passive BGA Pin Array Adhesive
Heat Sink Passive BGA Pin Array Adhesive
auf Bestellung 64 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 19+ | 9.06 EUR |
| 26+ | 8.04 EUR |
| D10650-40 |
|
Hersteller: Wakefield-Vette, Inc
Heat Sink Passive BGA Pin Array Adhesive
Heat Sink Passive BGA Pin Array Adhesive
auf Bestellung 1140 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 13.95 EUR |
| 50+ | 13.47 EUR |
| 100+ | 12.91 EUR |
| 260+ | 12.19 EUR |
| 510+ | 7.28 EUR |