D1MPC0805QR010FF-T5 Thin Film Technology Corp.
Hersteller: Thin Film Technology Corp.
Description: RES 0.01 OHM 1% 1/2W 0805
Resistance: 10 mOhms
Height - Seated (Max): 0.024" (0.60mm)
Supplier Device Package: 0805
Number of Terminations: 2
Operating Temperature: -55°C ~ 155°C
Composition: Metal Foil
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Temperature Coefficient: ±50ppm/°C
Package / Case: 0805 (2012 Metric)
Features: Anti-Sulfur, Current Sense, Moisture Resistant
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Packaging: Cut Tape (CT)
| Anzahl | Preis |
|---|---|
| 42+ | 0.42 EUR |
| 67+ | 0.27 EUR |
| 79+ | 0.22 EUR |
| 89+ | 0.2 EUR |
| 101+ | 0.18 EUR |
| 250+ | 0.15 EUR |
| 500+ | 0.14 EUR |
| 1000+ | 0.12 EUR |
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Technische Details D1MPC0805QR010FF-T5 Thin Film Technology Corp.
Description: RES 0.01 OHM 1% 1/2W 0805, Resistance: 10 mOhms, Height - Seated (Max): 0.024" (0.60mm), Supplier Device Package: 0805, Number of Terminations: 2, Operating Temperature: -55°C ~ 155°C, Composition: Metal Foil, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Temperature Coefficient: ±50ppm/°C, Package / Case: 0805 (2012 Metric), Features: Anti-Sulfur, Current Sense, Moisture Resistant, Tolerance: ±1%, Power (Watts): 0.5W, 1/2W, Packaging: Tape & Reel (TR).
Weitere Produktangebote D1MPC0805QR010FF-T5
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D1MPC0805QR010FF-T5 | Hersteller : Thin Film Technology Corp. |
Description: RES 0.01 OHM 1% 1/2W 0805Resistance: 10 mOhms Height - Seated (Max): 0.024" (0.60mm) Supplier Device Package: 0805 Number of Terminations: 2 Operating Temperature: -55°C ~ 155°C Composition: Metal Foil Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Temperature Coefficient: ±50ppm/°C Package / Case: 0805 (2012 Metric) Features: Anti-Sulfur, Current Sense, Moisture Resistant Tolerance: ±1% Power (Watts): 0.5W, 1/2W Packaging: Tape & Reel (TR) |
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