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D2608-42

D2608-42 Harwin Inc.

C004XX_Round_Pin_IC_Sockets.pdf
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Press-Fit
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 2340 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+4.21 EUR
10+3.66 EUR
25+3.51 EUR
50+3.43 EUR
100+3.27 EUR
250+2.96 EUR
500+2.73 EUR
1000+2.34 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details D2608-42 Harwin Inc.

Description: CONN IC DIP SOCKET 8POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Press-Fit, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.

Weitere Produktangebote D2608-42

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Preis
D2608-42 D2608-42 HARWIN D26XX.pdf Description: HARWIN - D2608-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D26, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: D26
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 1677 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
D2608-42 D26XX.pdf
D2608-42
Hersteller: HARWIN
Description: HARWIN - D2608-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D26, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: D26
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 1677 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH