DA14535-00000FX2 Renesas Electronics Corporation
Hersteller: Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 24FCGQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN, FC
Mounting Type: Surface Mount
Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.2V ~ 3.3V
Power - Output: 4dBm
Protocol: Bluetooth v5.3
Supplier Device Package: 24-FCGQFN (2.2x3)
GPIO: 12
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB
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Technische Details DA14535-00000FX2 Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 24FCGQFN, Packaging: Tape & Reel (TR), Package / Case: 24-WFQFN, FC, Mounting Type: Surface Mount, Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM, Type: TxRx + MCU, Operating Temperature: -40°C ~ 105°C, Voltage - Supply: 1.2V ~ 3.3V, Power - Output: 4dBm, Protocol: Bluetooth v5.3, Supplier Device Package: 24-FCGQFN (2.2x3), GPIO: 12, RF Family/Standard: Bluetooth, Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB.
Weitere Produktangebote DA14535-00000FX2 nach Preis ab 2.39 EUR bis 4 EUR
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DA14535-00000FX2 | Renesas Electronics Corporation |
Description: IC RF TXRX+MCU BLE 24FCGQFN Packaging: Cut Tape (CT) Package / Case: 24-WFQFN, FC Mounting Type: Surface Mount Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.2V ~ 3.3V Power - Output: 4dBm Protocol: Bluetooth v5.3 Supplier Device Package: 24-FCGQFN (2.2x3) GPIO: 12 RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB |
auf Bestellung 5805 Stücke: Lieferzeit 10-14 Tag (e) |
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DA14535-00000FX2 | Renesas / Dialog |
RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package |
auf Bestellung 2137 Stücke: Lieferzeit 10-14 Tag (e) |
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| DA14535-00000FX2 |
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Hersteller: Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 24FCGQFN
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN, FC
Mounting Type: Surface Mount
Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.2V ~ 3.3V
Power - Output: 4dBm
Protocol: Bluetooth v5.3
Supplier Device Package: 24-FCGQFN (2.2x3)
GPIO: 12
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB
Description: IC RF TXRX+MCU BLE 24FCGQFN
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN, FC
Mounting Type: Surface Mount
Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.2V ~ 3.3V
Power - Output: 4dBm
Protocol: Bluetooth v5.3
Supplier Device Package: 24-FCGQFN (2.2x3)
GPIO: 12
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB
auf Bestellung 5805 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.97 EUR |
| 10+ | 3.43 EUR |
| 25+ | 3.24 EUR |
| 100+ | 2.98 EUR |
| 250+ | 2.82 EUR |
| 500+ | 2.7 EUR |
| 1000+ | 2.59 EUR |
| DA14535-00000FX2 |
|
Hersteller: Renesas / Dialog
RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
auf Bestellung 2137 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4 EUR |
| 10+ | 3.45 EUR |
| 25+ | 3.27 EUR |
| 100+ | 3 EUR |
| 250+ | 2.83 EUR |
| 500+ | 2.7 EUR |
| 1000+ | 2.39 EUR |