DA14581-00AT1 Renesas Electronics Corporation
Hersteller: Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 40QFN
Part Status: Not For New Designs
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 24
Supplier Device Package: 40-QFN (5x5)
Current - Transmitting: 3.4mA
DigiKey Programmable: Not Verified
Current - Receiving: 3.7mA
Protocol: Bluetooth v4.1
Power - Output: -1dBm
Voltage - Supply: 2.35V ~ 3.3V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 32kB OTP, 84kB ROM, 50kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -93dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Bulk
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Technische Details DA14581-00AT1 Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 40QFN, Part Status: Not For New Designs, Serial Interfaces: I2C, SPI, UART, RF Family/Standard: Bluetooth, GPIO: 24, Supplier Device Package: 40-QFN (5x5), Current - Transmitting: 3.4mA, DigiKey Programmable: Not Verified, Current - Receiving: 3.7mA, Protocol: Bluetooth v4.1, Power - Output: -1dBm, Voltage - Supply: 2.35V ~ 3.3V, Operating Temperature: -40°C ~ 85°C, Type: TxRx + MCU, Memory Size: 32kB OTP, 84kB ROM, 50kB SRAM, Frequency: 2.4GHz, Mounting Type: Surface Mount, Sensitivity: -93dBm, Package / Case: 40-VFQFN Exposed Pad, Packaging: Bulk.
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|---|---|---|---|---|---|
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DA14581-00AT1 | Dialog Semiconductor |
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Hersteller: Dialog Semiconductor
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications 24 GPIOs in QFN40 and 0.4mm pin pitch package
RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications 24 GPIOs in QFN40 and 0.4mm pin pitch package
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH