DF12(3.0)-60DS-0.5V(86) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 60P V SMT DR RECPT 3.0MM STACK HT GOLD
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Produktbewertung abgeben
Technische Details DF12(3.0)-60DS-0.5V(86) Hirose Connector
Description: CONN RCPT 60POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 3mm, Contact Finish Thickness: 8.00µin (0.203µm), Height Above Board: 0.087" (2.20mm), Pitch: 0.020" (0.50mm), Number of Positions: 60, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote DF12(3.0)-60DS-0.5V(86) nach Preis ab 1.33 EUR bis 2.89 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| DF12(3.0)-60DS-0.5V(86) | Hirose |
Conn Board to Board RCP 60 POS 0.5mm Solder ST SMD T/R |
auf Bestellung 1097 Stücke: Lieferzeit 14-21 Tag (e) |
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| DF12(3.0)-60DS-0.5V(86) |
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Hersteller: Hirose
Conn Board to Board RCP 60 POS 0.5mm Solder ST SMD T/R
Conn Board to Board RCP 60 POS 0.5mm Solder ST SMD T/R
auf Bestellung 1097 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 61+ | 2.89 EUR |
| 72+ | 2.33 EUR |
| 73+ | 2.23 EUR |
| 75+ | 2.09 EUR |
| 100+ | 1.9 EUR |
| 250+ | 1.64 EUR |
| 500+ | 1.44 EUR |
| 1000+ | 1.33 EUR |