
DF12C(3.0)-50DS-0.5V(81) Hirose Connector

Board to Board & Mezzanine Connectors 50P V SMT DR RECPT 3.0MM HT W/O BOS,FIT
auf Bestellung 1815 Stücke:
Lieferzeit 10-14 Tag (e)
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Technische Details DF12C(3.0)-50DS-0.5V(81) Hirose Connector
Description: CONN RCPT 50POS SMD GOLD, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 50, Pitch: 0.020" (0.50mm), Height Above Board: 0.087" (2.20mm), Contact Finish Thickness: 8.00µin (0.203µm), Mated Stacking Heights: 3mm, Number of Rows: 2.
Weitere Produktangebote DF12C(3.0)-50DS-0.5V(81)
Foto | Bezeichnung | Hersteller | Beschreibung |
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DF12C(3.0)-50DS-0.5V(81) | Hersteller : Hirose |
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auf Bestellung 36000 Stücke: Lieferzeit 21-28 Tag (e) |
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DF12C(3.0)-50DS-0.5V(81) Produktcode: 48338
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DF12C(3.0)-50DS-0.5V(81) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 50 Pitch: 0.020" (0.50mm) Height Above Board: 0.087" (2.20mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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DF12C(3.0)-50DS-0.5V(81) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 50 Pitch: 0.020" (0.50mm) Height Above Board: 0.087" (2.20mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |