DF12NB-30DS-0.5V(51) Hirose
| Anzahl | Privatkunde |
|---|---|
| 500+ | 1.21 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
500 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details DF12NB-30DS-0.5V(51) Hirose
Category: Board-to-board connectors, Description: Connector: PCB to PCB; socket; female; PIN: 30; DF12N; vertical, Contact plating: gold-plated, Spatial orientation: vertical, Rated voltage: 50V, Manufacturer series: DF12N, Contacts pitch: 0.5mm, Number of pins: 30, Current rating: 0.3A, Mechanical durability: 50 cycles, Body colour: black, Mechanical mounting: on PCBs, Electrical mounting: SMT, Type of connector: PCB to PCB, Alias: CL0537-0287-0-51, Kind of connector: female, Connector: socket.
Weitere Produktangebote DF12NB-30DS-0.5V(51) nach Preis ab 1.21 EUR bis 2.34 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DF12NB-30DS-0.5V(51) | Hirose |
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R |
auf Bestellung 767 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||
|
DF12NB-30DS-0.5V(51) | Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLDFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.020" (0.50mm) Height Above Board: 0.106" (2.70mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3.5mm, 4mm, 5mm Part Status: Active Number of Rows: 2 |
auf Bestellung 40000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
DF12NB-30DS-0.5V(51) | Hirose |
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R |
auf Bestellung 500 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||
|
DF12NB-30DS-0.5V(51) | HIROSE(HRS) |
Description: HIROSE(HRS) - DF12NB-30DS-0.5V(51) - Mezzanine-Steckverbinder, Buchse, 0.5 mm, 2 Reihe(n), 30 Kontakt(e), OberflächenmontageKontaktüberzug: Vergoldete Kontakte Rastermaß: 0.5 Anzahl der Kontakte: 30 Mezzanine-Steckverbinder: Buchse Anzahl der Reihen: 2 Kontaktmaterial: Phosphor-Kupfer Steckverbindermontage: Oberflächenmontage Produktpalette: DF12N SVHC: No SVHC (25-Jun-2020) |
auf Bestellung 1141 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||
|
DF12NB-30DS-0.5V(51) | Hirose Connector |
Board to Board & Mezzanine Connectors CONN RCPT 30POS SMD |
auf Bestellung 5302 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
DF12NB-30DS-0.5V(51) | Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLDFeatures: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.020" (0.50mm) Height Above Board: 0.106" (2.70mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3.5mm, 4mm, 5mm Part Status: Active Number of Rows: 2 |
auf Bestellung 40488 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
DF12NB-30DS-0.5V(51) | Hirose |
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R |
auf Bestellung 120 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 13 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
DF12NB-30DS-0.5V(51) | Hirose |
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R |
auf Bestellung 120 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 13 Stücke Im Einkaufswagen Stück im Wert von UAH |
| DF12NB-30DS-0.5V(51) |
![]() |
Hersteller: Hirose
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R
auf Bestellung 767 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 128+ | 1.42 EUR |
| 250+ | 1.33 EUR |
| 500+ | 1.26 EUR |
| DF12NB-30DS-0.5V(51) |
![]() |
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Height Above Board: 0.106" (2.70mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 3.5mm, 4mm, 5mm
Part Status: Active
Number of Rows: 2
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Height Above Board: 0.106" (2.70mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 3.5mm, 4mm, 5mm
Part Status: Active
Number of Rows: 2
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 1.43 EUR |
| 2000+ | 1.37 EUR |
| 3000+ | 1.32 EUR |
| 5000+ | 1.27 EUR |
| 7000+ | 1.25 EUR |
| 10000+ | 1.21 EUR |
| DF12NB-30DS-0.5V(51) |
![]() |
Hersteller: Hirose
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R
auf Bestellung 500 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 500+ | 1.44 EUR |
| DF12NB-30DS-0.5V(51) |
![]() |
Hersteller: HIROSE(HRS)
Description: HIROSE(HRS) - DF12NB-30DS-0.5V(51) - Mezzanine-Steckverbinder, Buchse, 0.5 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage
Kontaktüberzug: Vergoldete Kontakte
Rastermaß: 0.5
Anzahl der Kontakte: 30
Mezzanine-Steckverbinder: Buchse
Anzahl der Reihen: 2
Kontaktmaterial: Phosphor-Kupfer
Steckverbindermontage: Oberflächenmontage
Produktpalette: DF12N
SVHC: No SVHC (25-Jun-2020)
Description: HIROSE(HRS) - DF12NB-30DS-0.5V(51) - Mezzanine-Steckverbinder, Buchse, 0.5 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage
Kontaktüberzug: Vergoldete Kontakte
Rastermaß: 0.5
Anzahl der Kontakte: 30
Mezzanine-Steckverbinder: Buchse
Anzahl der Reihen: 2
Kontaktmaterial: Phosphor-Kupfer
Steckverbindermontage: Oberflächenmontage
Produktpalette: DF12N
SVHC: No SVHC (25-Jun-2020)
auf Bestellung 1141 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 116+ | 2.17 EUR |
| 119+ | 1.95 EUR |
| 123+ | 1.75 EUR |
| 200+ | 1.58 EUR |
| 500+ | 1.43 EUR |
| DF12NB-30DS-0.5V(51) |
![]() |
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors CONN RCPT 30POS SMD
Board to Board & Mezzanine Connectors CONN RCPT 30POS SMD
auf Bestellung 5302 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.28 EUR |
| 10+ | 1.95 EUR |
| 25+ | 1.74 EUR |
| 100+ | 1.65 EUR |
| 250+ | 1.55 EUR |
| 500+ | 1.4 EUR |
| 1000+ | 1.39 EUR |
| DF12NB-30DS-0.5V(51) |
![]() |
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Height Above Board: 0.106" (2.70mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 3.5mm, 4mm, 5mm
Part Status: Active
Number of Rows: 2
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Height Above Board: 0.106" (2.70mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 3.5mm, 4mm, 5mm
Part Status: Active
Number of Rows: 2
auf Bestellung 40488 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.34 EUR |
| 11+ | 1.99 EUR |
| 25+ | 1.86 EUR |
| 50+ | 1.77 EUR |
| 100+ | 1.69 EUR |
| 250+ | 1.58 EUR |
| 500+ | 1.5 EUR |
| DF12NB-30DS-0.5V(51) |
![]() |
Hersteller: Hirose
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R
auf Bestellung 120 Stücke:
Lieferzeit 14-21 Tag (e)
| DF12NB-30DS-0.5V(51) |
![]() |
Hersteller: Hirose
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R
Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R
auf Bestellung 120 Stücke:
Lieferzeit 14-21 Tag (e)





