DF12NC(3.0)-30DS-0.5V(51) Hirose
auf Bestellung 156 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 141+ | 1.02 EUR |
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Technische Details DF12NC(3.0)-30DS-0.5V(51) Hirose
Description: CONN RCPT 30POS SMD GOLD, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.020" (0.50mm), Height Above Board: 0.087" (2.20mm), Contact Finish Thickness: 8.00µin (0.203µm), Mated Stacking Heights: 3mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote DF12NC(3.0)-30DS-0.5V(51) nach Preis ab 0.87 EUR bis 1.88 EUR
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DF12NC(3.0)-30DS-0.5V(51) | Hersteller : Hirose |
 Conn Board to Board RCP 30 POS 0.5mm Solder ST SMD T/R |
auf Bestellung 520 Stücke: Lieferzeit 14-21 Tag (e) |
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DF12NC(3.0)-30DS-0.5V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.020" (0.50mm) Height Above Board: 0.087" (2.20mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Part Status: Active Number of Rows: 2 |
auf Bestellung 3100 Stücke: Lieferzeit 10-14 Tag (e) |
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DF12NC(3.0)-30DS-0.5V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.020" (0.50mm) Height Above Board: 0.087" (2.20mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Part Status: Active Number of Rows: 2 |
auf Bestellung 3237 Stücke: Lieferzeit 10-14 Tag (e) |
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DF12NC(3.0)-30DS-0.5V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors CONN RCPT 30POS SMD |
auf Bestellung 5786 Stücke: Lieferzeit 10-14 Tag (e) |
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