DF15(0.8)-20DS-0.65V(56) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors 20P RECP .8MM HEIGHT 798-DF150830DS065V5
auf Bestellung 685 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 4.88 EUR |
| 10+ | 4.45 EUR |
| 100+ | 3.92 EUR |
| 250+ | 3.43 EUR |
| 500+ | 3.33 EUR |
| 1000+ | 2.82 EUR |
| 2000+ | 2.62 EUR |
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Technische Details DF15(0.8)-20DS-0.65V(56) Hirose Connector
Description: CONN RCPT 20POS SMD GOLD, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.026" (0.65mm), Height Above Board: 0.118" (3.00mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 4mm, 5mm, 7mm, Part Status: Obsolete, Number of Rows: 2.
Weitere Produktangebote DF15(0.8)-20DS-0.65V(56) nach Preis ab 1.70 EUR bis 2.95 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| DF15(0.8)-20DS-0.65V(56) | Hersteller : Hirose |
Conn Board to Board RCP 20 POS 0.65mm Solder ST SMD T/R |
auf Bestellung 4663 Stücke: Lieferzeit 14-21 Tag (e) |
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DF15(0.8)-20DS-0.65V(56) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 20POS SMD GOLD Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.026" (0.65mm) Height Above Board: 0.118" (3.00mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 4mm, 5mm, 7mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |