DF30FB-60DS-0.4V(82) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 0.9mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.035" (0.88mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 60
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Outer Shroud Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
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Technische Details DF30FB-60DS-0.4V(82) Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 0.9mm, Contact Finish Thickness: 2.00µin (0.051µm), Height Above Board: 0.035" (0.88mm), Pitch: 0.016" (0.40mm), Number of Positions: 60, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Outer Shroud Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote DF30FB-60DS-0.4V(82)
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DF30FB-60DS-0.4V(82) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 60POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.9mm Contact Finish Thickness: 2.00µin (0.051µm) Height Above Board: 0.035" (0.88mm) Pitch: 0.016" (0.40mm) Number of Positions: 60 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Outer Shroud Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
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DF30FB-60DS-0.4V(82) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 60P DR SMT RECEPT W/FITTING, NO BOSS |
Produkt ist nicht verfügbar |