DF9-11S-1V(32) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
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Technische Details DF9-11S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 11, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote DF9-11S-1V(32) nach Preis ab 1.21 EUR bis 1.89 EUR
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DF9-11S-1V(32) | Hirose Electric Co Ltd |
Description: CONN RCPT 11POS SMD TIN Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 11 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Part Status: Active Number of Rows: 2 |
auf Bestellung 2096 Stücke: Lieferzeit 10-14 Tag (e) |
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DF9-11S-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING |
auf Bestellung 1213 Stücke: Lieferzeit 10-14 Tag (e) |
|
| DF9-11S-1V(32) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
Description: CONN RCPT 11POS SMD TIN
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
auf Bestellung 2096 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.88 EUR |
| 14+ | 1.61 EUR |
| 25+ | 1.5 EUR |
| 50+ | 1.43 EUR |
| 100+ | 1.37 EUR |
| 250+ | 1.27 EUR |
| 500+ | 1.21 EUR |
| DF9-11S-1V(32) |
|
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING
auf Bestellung 1213 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.89 EUR |
| 10+ | 1.62 EUR |
| 25+ | 1.44 EUR |
| 100+ | 1.4 EUR |
| 250+ | 1.37 EUR |
| 500+ | 1.33 EUR |
| 1000+ | 1.3 EUR |