DF9-13S-1V(32) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 13POS SMD TIN
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 13
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1000+ | 0.93 EUR |
| 2000+ | 0.88 EUR |
| 3000+ | 0.85 EUR |
| 5000+ | 0.82 EUR |
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Technische Details DF9-13S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 13POS SMD TIN, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 13, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote DF9-13S-1V(32) nach Preis ab 0.64 EUR bis 1.72 EUR
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DF9-13S-1V(32) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 13P TIN PLATING |
auf Bestellung 5914 Stücke: Lieferzeit 10-14 Tag (e) |
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DF9-13S-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 13POS SMD TIN Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 13 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Part Status: Active Number of Rows: 2 |
auf Bestellung 6932 Stücke: Lieferzeit 10-14 Tag (e) |
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| DF9-13S-1V(32) | Hersteller : Hirose |
Conn Board to Board RCP 13 POS 1mm Solder ST SMD T/R |
auf Bestellung 2000 Stücke: Lieferzeit 14-21 Tag (e) |
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