DF9-13S-1V(32) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 13POS SMD TIN
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 13
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
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Technische Details DF9-13S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 13POS SMD TIN, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 13, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Receptacle, Outer Shroud Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote DF9-13S-1V(32) nach Preis ab 1.2 EUR bis 2.03 EUR
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DF9-13S-1V(32) | Hirose Electric Co Ltd |
Description: CONN RCPT 13POS SMD TIN Mated Stacking Heights: 4.3mm Contact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) Number of Positions: 13 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Receptacle, Outer Shroud Contacts Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Number of Rows: 2 Part Status: Active |
auf Bestellung 2106 Stücke: Lieferzeit 10-14 Tag (e) |
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DF9-13S-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 13P TIN PLATING |
auf Bestellung 2959 Stücke: Lieferzeit 10-14 Tag (e) |
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| DF9-13S-1V(32) | Hirose |
Conn Board to Board RCP 13 POS 1mm Solder ST SMD T/R |
auf Bestellung 90 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH |
| DF9-13S-1V(32) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 13POS SMD TIN
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 13
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 2
Part Status: Active
Description: CONN RCPT 13POS SMD TIN
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 13
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 2
Part Status: Active
auf Bestellung 2106 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.87 EUR |
| 14+ | 1.58 EUR |
| 25+ | 1.49 EUR |
| 50+ | 1.42 EUR |
| 100+ | 1.34 EUR |
| 250+ | 1.26 EUR |
| 500+ | 1.2 EUR |
| DF9-13S-1V(32) |
|
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 13P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 13P TIN PLATING
auf Bestellung 2959 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.03 EUR |
| 10+ | 1.73 EUR |
| 25+ | 1.54 EUR |
| 100+ | 1.46 EUR |
| 250+ | 1.45 EUR |
| 500+ | 1.39 EUR |
| 1000+ | 1.37 EUR |
| DF9-13S-1V(32) |
|
Hersteller: Hirose
Conn Board to Board RCP 13 POS 1mm Solder ST SMD T/R
Conn Board to Board RCP 13 POS 1mm Solder ST SMD T/R
auf Bestellung 90 Stücke:
Lieferzeit 14-21 Tag (e)