DF9-21S-1V(32) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 21POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 21
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 1000+ | 1.22 EUR |
| 2000+ | 1.16 EUR |
| 3000+ | 1.13 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details DF9-21S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 21POS SMD TIN, Number of Rows: 2, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 21, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Receptacle, Outer Shroud Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote DF9-21S-1V(32) nach Preis ab 1.28 EUR bis 2.01 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DF9-21S-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 21POS SMD TINNumber of Rows: 2 Mated Stacking Heights: 4.3mm Contact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) Number of Positions: 21 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Receptacle, Outer Shroud Contacts Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) |
auf Bestellung 3374 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
DF9-21S-1V(32) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 21P TIN PLATING |
auf Bestellung 5754 Stücke: Lieferzeit 10-14 Tag (e) |
|
