DF9-23S-1V(69) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 23POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 8.00µin (0.203µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 23
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Contact Finish: Gold
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Technische Details DF9-23S-1V(69) Hirose Electric Co Ltd
Description: CONN RCPT 23POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 8.00µin (0.203µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 23, Connector Type: Receptacle, Outer Shroud Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Contact Finish: Gold.
Weitere Produktangebote DF9-23S-1V(69)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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DF9-23S-1V(69) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 23P GOLD PLATING |
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