DF9-25P-1V(32) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 25POS SMD TIN
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Number of Rows: 2
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 1.68 EUR |
| 2000+ | 1.61 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
1000 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details DF9-25P-1V(32) Hirose Electric Co Ltd
Description: CONN HDR 25POS SMD TIN, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 25, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Weitere Produktangebote DF9-25P-1V(32) nach Preis ab 1.63 EUR bis 3.67 EUR
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DF9-25P-1V(32) | Hirose Electric Co Ltd |
Description: CONN HDR 25POS SMD TIN Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 25 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
auf Bestellung 2506 Stücke: Lieferzeit 10-14 Tag (e) |
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DF9-25P-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 25P TIN PLATING |
auf Bestellung 1521 Stücke: Lieferzeit 10-14 Tag (e) |
|
| DF9-25P-1V(32) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 25POS SMD TIN
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Number of Rows: 2
Description: CONN HDR 25POS SMD TIN
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Number of Rows: 2
auf Bestellung 2506 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.53 EUR |
| 10+ | 2.15 EUR |
| 25+ | 2.01 EUR |
| 50+ | 1.92 EUR |
| 100+ | 1.83 EUR |
| 250+ | 1.71 EUR |
| 500+ | 1.63 EUR |
| DF9-25P-1V(32) |
|
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 25P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 25P TIN PLATING
auf Bestellung 1521 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.67 EUR |
| 10+ | 3.09 EUR |
| 25+ | 2.76 EUR |
| 100+ | 2.64 EUR |
| 250+ | 2.49 EUR |
| 500+ | 2.31 EUR |
| 1000+ | 2.14 EUR |