DF9-25S-1V(32) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 25POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 25
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 1000+ | 1.45 EUR |
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Technische Details DF9-25S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 25POS SMD TIN, Number of Rows: 2, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 25, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Receptacle, Outer Shroud Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote DF9-25S-1V(32) nach Preis ab 1.4 EUR bis 2.34 EUR
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DF9-25S-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 25POS SMD TIN Contact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) Number of Positions: 25 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Receptacle, Outer Shroud Contacts Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Number of Rows: 2 Mated Stacking Heights: 4.3mm |
auf Bestellung 1127 Stücke: Lieferzeit 10-14 Tag (e) |
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DF9-25S-1V(32) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 25P TIN PLATING |
auf Bestellung 1596 Stücke: Lieferzeit 10-14 Tag (e) |
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