DF9B-11P-1V(32) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors 1.0MM V SMT HEADER 11P TIN PLT MTL FIT
auf Bestellung 3704 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.66 EUR |
| 10+ | 1.53 EUR |
| 100+ | 1.37 EUR |
| 500+ | 1.12 EUR |
| 1000+ | 0.86 EUR |
| 2000+ | 0.81 EUR |
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Technische Details DF9B-11P-1V(32) Hirose Connector
Description: CONN HDR 11POS SMD TIN, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 11, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Weitere Produktangebote DF9B-11P-1V(32) nach Preis ab 1.67 EUR bis 1.67 EUR
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DF9B-11P-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 11POS SMD TIN Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 11 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
auf Bestellung 903 Stücke: Lieferzeit 10-14 Tag (e) |
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DF9B-11P-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 11POS SMD TIN Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 11 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |