DILB24P-223TLF Amphenol FCI
| Anzahl | Preis |
|---|---|
| 3+ | 1.26 EUR |
| 10+ | 1.04 EUR |
| 20+ | 0.85 EUR |
| 100+ | 0.8 EUR |
| 260+ | 0.78 EUR |
| 500+ | 0.71 EUR |
| 1000+ | 0.68 EUR |
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Technische Details DILB24P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 24POS TINLEAD, Part Status: Active, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Mating: Tin-Lead, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA), Nylon, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote DILB24P-223TLF nach Preis ab 0.75 EUR bis 1.3 EUR
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DILB24P-223TLF | Amphenol ICC (FCI) |
 Description: CONN IC DIP SOCKET 24POS TINLEADPart Status: Active Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA), Nylon Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 6653 Stücke: Lieferzeit 10-14 Tag (e) |
|
| DILB24P-223TLF |
|
Hersteller: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 24POS TINLEAD
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 24POS TINLEAD
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 6653 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 14+ | 1.3 EUR |
| 20+ | 1.05 EUR |
| 40+ | 1 EUR |
| 60+ | 0.97 EUR |
| 100+ | 0.94 EUR |
| 260+ | 0.88 EUR |
| 500+ | 0.84 EUR |
| 1000+ | 0.8 EUR |
| 2500+ | 0.75 EUR |