| Anzahl | Preis |
|---|---|
| 2+ | 1.65 EUR |
| 10+ | 1.32 EUR |
| 30+ | 1.22 EUR |
| 105+ | 1.13 EUR |
| 255+ | 1.07 EUR |
| 510+ | 0.97 EUR |
| 1005+ | 0.95 EUR |
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Technische Details DILB32P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 32POS TINLEAD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polyamide (PA), Nylon, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy, Part Status: Active.
Weitere Produktangebote DILB32P-223TLF nach Preis ab 0.98 EUR bis 1.71 EUR
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DILB32P-223TLF | Amphenol ICC (FCI) |
 Description: CONN IC DIP SOCKET 32POS TINLEADPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA), Nylon Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Material - Post: Copper Alloy Part Status: Active |
auf Bestellung 3717 Stücke: Lieferzeit 10-14 Tag (e) |
|
| DILB32P-223TLF |
|
Hersteller: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 32POS TINLEAD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA), Nylon
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TINLEAD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA), Nylon
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
auf Bestellung 3717 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11+ | 1.71 EUR |
| 15+ | 1.41 EUR |
| 30+ | 1.34 EUR |
| 60+ | 1.28 EUR |
| 105+ | 1.23 EUR |
| 255+ | 1.16 EUR |
| 510+ | 1.1 EUR |
| 1005+ | 1.05 EUR |
| 2505+ | 0.98 EUR |