auf Bestellung 5010 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 1.64 EUR |
10+ | 1.15 EUR |
105+ | 1.03 EUR |
510+ | 0.97 EUR |
1005+ | 0.9 EUR |
2505+ | 0.85 EUR |
5010+ | 0.83 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details DILB32P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 32POS TINLEAD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polyamide (PA), Nylon, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy, Part Status: Active.
Weitere Produktangebote DILB32P-223TLF nach Preis ab 0.9 EUR bis 1.8 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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DILB32P-223TLF | Hersteller : Amphenol ICC (FCI) |
Description: CONN IC DIP SOCKET 32POS TINLEAD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA), Nylon Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Material - Post: Copper Alloy Part Status: Active |
auf Bestellung 7025 Stücke: Lieferzeit 10-14 Tag (e) |
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DILB32P-223TLF | Hersteller : FCI | Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |
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DILB32P-223TLF | Hersteller : AMPHENOL | DILB32P223TLF-AMP Unclassified |
Produkt ist nicht verfügbar |