DIP300-SOIC-16W Chip Quik
Hersteller: Chip Quik
IC & Component Sockets DIP-16 (0.3" width, 0.1" pitch) to SOIC-16 Wide (1.27mm pitch, 300 mil body) Adapter
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Technische Details DIP300-SOIC-16W Chip Quik
Description: DIP-16 (0.3" WIDTH, 0.1" PITCH), Packaging: Bulk, Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to SMD, Package Accepted: DIP.
Weitere Produktangebote DIP300-SOIC-16W nach Preis ab 16.08 EUR bis 22.24 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DIP300-SOIC-16W | Chip Quik Inc. |
Description: DIP-16 (0.3" WIDTH, 0.1" PITCH) Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to SMD Package Accepted: DIP |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
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| DIP300-SOIC-16W |
|
Hersteller: Chip Quik Inc.
Description: DIP-16 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
Description: DIP-16 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.24 EUR |
| 5+ | 19.22 EUR |
| 10+ | 18.15 EUR |
| 25+ | 16.9 EUR |
| 50+ | 16.08 EUR |