DIP300-SOIC-20W Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: DIP-20 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
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Technische Details DIP300-SOIC-20W Chip Quik Inc.
Description: DIP-20 (0.3" WIDTH, 0.1" PITCH), Packaging: Bulk, Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC.
Weitere Produktangebote DIP300-SOIC-20W
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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DIP300-SOIC-20W | Hersteller : Chip Quik |
IC & Component Sockets DIP-20 (0.3" width, 0.1" pitch) to SOIC-20 Wide (1.27mm pitch, 300 mil body) Adapter |
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