DIP300-SOIC-28N Chip Quik
Hersteller: Chip Quik
IC & Component Sockets DIP-28 (0.3" width, 0.1" pitch) to SOIC-28 Narrow (1.27mm pitch, 150/200 mil body) Adapter
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Technische Details DIP300-SOIC-28N Chip Quik
Description: DIP-28 (0.3" WIDTH, 0.1" PITCH), Packaging: Bulk, Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC.
Weitere Produktangebote DIP300-SOIC-28N nach Preis ab 20.29 EUR bis 26.56 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DIP300-SOIC-28N | Chip Quik Inc. |
Description: DIP-28 (0.3" WIDTH, 0.1" PITCH) Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
|
| DIP300-SOIC-28N |
|
Hersteller: Chip Quik Inc.
Description: DIP-28 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-28 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.56 EUR |
| 5+ | 23.01 EUR |
| 10+ | 21.75 EUR |
| 25+ | 20.29 EUR |