DSC1103DI1-080.0000 Microchip Technology
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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Technische Details DSC1103DI1-080.0000 Microchip Technology
Description: OSC MEMS LVDS SMD, Packaging: Tube, Package / Case: 6-VDFN, Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm), Mounting Type: Surface Mount, Output: LVDS, Function: Standby (Power Down), Type: XO (Standard), Operating Temperature: -40°C ~ 85°C, Frequency Stability: ±50ppm, Voltage - Supply: 2.25V ~ 3.63V, Current - Supply (Max): 32mA, Height - Seated (Max): 0.035" (0.90mm), Frequency: 80 MHz, Base Resonator: MEMS.