ED16DT On Shore Technology Inc.

Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 2385 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
44+ | 0.40 EUR |
52+ | 0.34 EUR |
56+ | 0.32 EUR |
60+ | 0.30 EUR |
120+ | 0.29 EUR |
270+ | 0.27 EUR |
510+ | 0.26 EUR |
1020+ | 0.25 EUR |
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Technische Details ED16DT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 110°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
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ED16DT | Hersteller : On-Shore Technology, Inc |
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