EFR32BG27C320F768IJ39-BR Silicon Labs
Hersteller: Silicon LabsDescription: SOC WLCSP39 PACKAGE HIGH TEMP
Packaging: Tape & Reel (TR)
Package / Case: 39-UFBGA, WLCSP
Sensitivity: -106.9dBm
Mounting Type: Surface Mount
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 8dBm
Protocol: Bluetooth v5.4
Current - Receiving: 3.6mA ~ 4.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 24.1mA
Supplier Device Package: 39-WLCSP (2.63x2.29)
GPIO: 19
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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Technische Details EFR32BG27C320F768IJ39-BR Silicon Labs
Description: SOC WLCSP39 PACKAGE HIGH TEMP, Packaging: Tape & Reel (TR), Package / Case: 39-UFBGA, WLCSP, Sensitivity: -106.9dBm, Mounting Type: Surface Mount, Memory Size: 768kB Flash, 64kB RAM, Type: TxRx + MCU, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 1.71V ~ 3.8V, Power - Output: 8dBm, Protocol: Bluetooth v5.4, Current - Receiving: 3.6mA ~ 4.5mA, Data Rate (Max): 2Mbps, Current - Transmitting: 4.1mA ~ 24.1mA, Supplier Device Package: 39-WLCSP (2.63x2.29), GPIO: 19, Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK, RF Family/Standard: 802.15.4, Bluetooth, Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART.