Produkte > SAMTEC INC. > EHF-113-01-L-D-SM-P-TR
EHF-113-01-L-D-SM-P-TR

EHF-113-01-L-D-SM-P-TR Samtec Inc.


ehf.pdf Hersteller: Samtec Inc.
Description: CONN HEADER SMD 26POS 1.27MM
Packaging: Tape & Reel (TR)
Features: Keying Slot, Pick and Place
Connector Type: Header
Current Rating (Amps): 1.75A
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Latch Lock/Eject Hooks
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.325" (8.25mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
auf Bestellung 150 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
150+10.94 EUR
Mindestbestellmenge: 150
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Produktbewertung abgeben

Technische Details EHF-113-01-L-D-SM-P-TR Samtec Inc.

Description: CONN HEADER SMD 26POS 1.27MM, Packaging: Tape & Reel (TR), Features: Keying Slot, Pick and Place, Connector Type: Header, Current Rating (Amps): 1.75A, Mounting Type: Surface Mount, Number of Positions: 26, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Latch Lock/Eject Hooks, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.325" (8.25mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).

Weitere Produktangebote EHF-113-01-L-D-SM-P-TR nach Preis ab 12.5 EUR bis 17.06 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
EHF-113-01-L-D-SM-P-TR EHF-113-01-L-D-SM-P-TR Hersteller : Samtec Inc. ehf.pdf Description: CONN HEADER SMD 26POS 1.27MM
Packaging: Cut Tape (CT)
Features: Keying Slot, Pick and Place
Connector Type: Header
Current Rating (Amps): 1.75A
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Latch Lock/Eject Hooks
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.325" (8.25mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.82 EUR
10+ 12.5 EUR
Mindestbestellmenge: 2
EHF-113-01-L-D-SM-P-TR EHF-113-01-L-D-SM-P-TR Hersteller : Samtec ehf-2854242.pdf Headers & Wire Housings .050" Shrouded IDC Header with Ejectors
auf Bestellung 1346 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
4+17.06 EUR
25+ 15.39 EUR
50+ 14.33 EUR
100+ 13.65 EUR
900+ 13.29 EUR
Mindestbestellmenge: 4