ERM8-013-05.0-S-DV-DS-L-K-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 26P SMD GOLD
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.351" (8.91mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 26
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Board Guide, Latches, Pick and Place
Packaging: Tape & Reel (TR)
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 10mm, 12mm, 15mm
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Technische Details ERM8-013-05.0-S-DV-DS-L-K-TR Samtec Inc.
Description: CONN DIFF ARRAY PLG 26P SMD GOLD, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.351" (8.91mm), Pitch: 0.031" (0.80mm), Number of Positions: 26, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Board Guide, Latches, Pick and Place, Packaging: Tape & Reel (TR), Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 10mm, 12mm, 15mm.
Weitere Produktangebote ERM8-013-05.0-S-DV-DS-L-K-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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ERM8-013-05.0-S-DV-DS-L-K-TR | Samtec |
 Board to Board & Mezzanine Connectors 0.80 mm Edge Rate Rugged High Speed Terminal |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| ERM8-013-05.0-S-DV-DS-L-K-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors 0.80 mm Edge Rate Rugged High Speed Terminal
Board to Board & Mezzanine Connectors 0.80 mm Edge Rate Rugged High Speed Terminal
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH