ESHF-105-01-L-D-SM Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.4 EUR |
| 34+ | 4.36 EUR |
| 102+ | 4.32 EUR |
| 510+ | 4.02 EUR |
| 2006+ | 3.75 EUR |
| 5032+ | 3.28 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details ESHF-105-01-L-D-SM Samtec
Description: CONN HEADER SMD 10POS 1.27MM, Features: Keying Slot, Packaging: Tube, Connector Type: Header, Current Rating (Amps): 3A, Mounting Type: Surface Mount, Number of Positions: 10, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.215" (5.45mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).
Weitere Produktangebote ESHF-105-01-L-D-SM nach Preis ab 4.44 EUR bis 6.41 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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ESHF-105-01-L-D-SM | Samtec Inc. |
 Description: CONN HEADER SMD 10POS 1.27MMFeatures: Keying Slot Packaging: Tube Connector Type: Header Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 10 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.215" (5.45mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
auf Bestellung 112 Stücke: Lieferzeit 10-14 Tag (e) |
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ESHF-105-01-L-D-SM | SAMTEC |
Description: SAMTEC - ESHF-105-01-L-D-SM - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 10 Kontakt(e), Oberflächenmontage, ESHF tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 10Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: ESHF productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm |
auf Bestellung 6 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| ESHF-105-01-L-D-SM |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 10POS 1.27MM
Features: Keying Slot
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 10
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.215" (5.45mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
Description: CONN HEADER SMD 10POS 1.27MM
Features: Keying Slot
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 10
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.215" (5.45mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.41 EUR |
| 50+ | 5.22 EUR |
| 100+ | 4.44 EUR |
| ESHF-105-01-L-D-SM |
|
Hersteller: SAMTEC
Description: SAMTEC - ESHF-105-01-L-D-SM - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 10 Kontakt(e), Oberflächenmontage, ESHF
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 10Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: ESHF
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
Description: SAMTEC - ESHF-105-01-L-D-SM - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 10 Kontakt(e), Oberflächenmontage, ESHF
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 10Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: ESHF
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
auf Bestellung 6 Stücke:
Lieferzeit 14-21 Tag (e)