
ESHF-108-01-L-D-SM-TR Samtec
auf Bestellung 298 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 6.71 EUR |
50+ | 5.47 EUR |
100+ | 4.65 EUR |
700+ | 4.49 EUR |
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Technische Details ESHF-108-01-L-D-SM-TR Samtec
Description: CONN HEADER SMD 16POS 1.27MM, Features: Keying Slot, Packaging: Tape & Reel (TR), Connector Type: Header, Mounting Type: Surface Mount, Number of Positions: 16, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.215" (5.45mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).
Weitere Produktangebote ESHF-108-01-L-D-SM-TR
Foto | Bezeichnung | Hersteller | Beschreibung |
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ESHF-108-01-L-D-SM-TR | Hersteller : Samtec Inc. |
![]() Features: Keying Slot Packaging: Tape & Reel (TR) Connector Type: Header Mounting Type: Surface Mount Number of Positions: 16 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.215" (5.45mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
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