ESHF-108-01-L-D-SM Samtec
auf Bestellung 889 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 7.23 EUR |
| 10+ | 5.74 EUR |
| 112+ | 5.39 EUR |
| 252+ | 4.26 EUR |
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Technische Details ESHF-108-01-L-D-SM Samtec
Description: CONN HEADER SMD 16POS 1.27MM, Packaging: Tube, Features: Keying Slot, Connector Type: Header, Mounting Type: Surface Mount, Number of Positions: 16, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.215" (5.45mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).
Weitere Produktangebote ESHF-108-01-L-D-SM nach Preis ab 6 EUR bis 7.5 EUR
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ESHF-108-01-L-D-SM | Hersteller : Samtec Inc. |
 Description: CONN HEADER SMD 16POS 1.27MMPackaging: Tube Features: Keying Slot Connector Type: Header Mounting Type: Surface Mount Number of Positions: 16 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.215" (5.45mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
auf Bestellung 155 Stücke: Lieferzeit 10-14 Tag (e) |
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