ESHF-113-01-L-D-SM Samtec Inc.

Description: CONN HEADER SMD 26POS 1.27MM, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 26, Mounting Type: Surface Mount, Connector Type: Header, Features: Keying Slot, Packaging: Tube, Contact Length - Mating: 0.120" (3.05mm), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.215" (5.45mm), Contact Shape: Square.