auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 4.56 EUR |
| 10+ | 4.14 EUR |
| 100+ | 3.54 EUR |
| 500+ | 2.94 EUR |
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Technische Details ESQ-105-33-T-D Samtec
Description: CONN SOCKET 10POS 0.1 TIN PCB, Packaging: Bulk, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 10, Style: Board to Board, Operating Temperature: -55°C ~ 105°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.090" (2.29mm), Insulation Height: 0.635" (16.13mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote ESQ-105-33-T-D nach Preis ab 3.58 EUR bis 4.61 EUR
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ESQ-105-33-T-D | Hersteller : Samtec Inc. |
 Description: CONN SOCKET 10POS 0.1 TIN PCBPackaging: Bulk Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.7A per Contact Mounting Type: Through Hole Number of Positions: 10 Style: Board to Board Operating Temperature: -55°C ~ 105°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.090" (2.29mm) Insulation Height: 0.635" (16.13mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 264 Stücke: Lieferzeit 10-14 Tag (e) |
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