| Anzahl | Privatkunde |
|---|---|
| 1+ | 7.04 EUR |
| 10+ | 6.75 EUR |
| 100+ | 5.63 EUR |
| 500+ | 4.77 EUR |
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Technische Details ESQ-106-33-L-D Samtec
Description: CONN SOCKET 12POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 12, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.090" (2.29mm), Insulation Height: 0.635" (16.13mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote ESQ-106-33-L-D nach Preis ab 5.88 EUR bis 7.35 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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ESQ-106-33-L-D | Samtec Inc. |
 Description: CONN SOCKET 12POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.7A per Contact Mounting Type: Through Hole Number of Positions: 12 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.090" (2.29mm) Insulation Height: 0.635" (16.13mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
|
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ESQ-106-33-L-D | SAMTEC |
Description: SAMTEC - ESQ-106-33-L-D - Printbuchse, Board-to-Board, 2.54 mm, 2 Reihe(n), 12 Kontakt(e), Durchsteckmontage, ESQ tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbindermontage: Durchsteckmontage usEccn: EAR99 Anzahl der Kontakte: 12Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: ESQ productTraceability: No Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (04-Feb-2026) |
auf Bestellung 37 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| ESQ-106-33-L-D |
|
Hersteller: Samtec Inc.
Description: CONN SOCKET 12POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.635" (16.13mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 12POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.635" (16.13mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.35 EUR |
| 10+ | 6.68 EUR |
| 100+ | 5.88 EUR |
| ESQ-106-33-L-D |
|
Hersteller: SAMTEC
Description: SAMTEC - ESQ-106-33-L-D - Printbuchse, Board-to-Board, 2.54 mm, 2 Reihe(n), 12 Kontakt(e), Durchsteckmontage, ESQ
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Durchsteckmontage
usEccn: EAR99
Anzahl der Kontakte: 12Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: ESQ
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (04-Feb-2026)
Description: SAMTEC - ESQ-106-33-L-D - Printbuchse, Board-to-Board, 2.54 mm, 2 Reihe(n), 12 Kontakt(e), Durchsteckmontage, ESQ
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Durchsteckmontage
usEccn: EAR99
Anzahl der Kontakte: 12Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: ESQ
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (04-Feb-2026)
auf Bestellung 37 Stücke:
Lieferzeit 14-21 Tag (e)