ESQ-112-39-L-D Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN SOCKET 24POS 0.1 GOLD PCB
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Height: 0.435" (11.05mm)
Contact Length - Post: 0.480" (12.19mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 24
Mounting Type: Through Hole
Current Rating (Amps): 5.7A per Contact
Voltage Rating: 550VAC
Connector Type: Elevated Socket
Packaging: Bulk
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Technische Details ESQ-112-39-L-D Samtec Inc.
Description: CONN SOCKET 24POS 0.1 GOLD PCB, Number of Rows: 2, Row Spacing - Mating: 0.100" (2.54mm), Insulation Height: 0.435" (11.05mm), Contact Length - Post: 0.480" (12.19mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 24, Mounting Type: Through Hole, Current Rating (Amps): 5.7A per Contact, Voltage Rating: 550VAC, Connector Type: Elevated Socket, Packaging: Bulk.
Weitere Produktangebote ESQ-112-39-L-D nach Preis ab 13.51 EUR bis 16.09 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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|---|---|---|---|---|---|---|---|---|---|---|---|
| ESQ-112-39-L-D | Samtec Inc. |
Description: CONN SOCKET 24POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.7A per Contact Mounting Type: Through Hole Number of Positions: 24 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Length - Post: 0.480" (12.19mm) Insulation Height: 0.435" (11.05mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 91 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ESQ-112-39-L-D |
|
Hersteller: Samtec Inc.
Description: CONN SOCKET 24POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 24
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.480" (12.19mm)
Insulation Height: 0.435" (11.05mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 24POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 24
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.480" (12.19mm)
Insulation Height: 0.435" (11.05mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 16.09 EUR |
| 25+ | 14.54 EUR |
| 50+ | 13.51 EUR |