| Anzahl | Privatkunde |
|---|---|
| 1+ | 12.13 EUR |
| 11+ | 12.1 EUR |
| 22+ | 11.39 EUR |
| 110+ | 10.36 EUR |
| 506+ | 10.34 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details ESQ-120-33-L-D Samtec
Description: CONN SOCKET 40POS 0.1 GOLD PCB, Packaging: Tube, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 40, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.090" (2.29mm), Insulation Height: 0.635" (16.13mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote ESQ-120-33-L-D nach Preis ab 9.32 EUR bis 13.78 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
ESQ-120-33-L-D | Samtec Inc. |
 Description: CONN SOCKET 40POS 0.1 GOLD PCBPackaging: Tube Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.7A per Contact Mounting Type: Through Hole Number of Positions: 40 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.090" (2.29mm) Insulation Height: 0.635" (16.13mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 171 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
 |
ESQ-120-33-L-D | SAMTEC |
Description: SAMTEC - ESQ-120-33-L-D - Stapelbare Leiterplattensteckverbinder, erhöht, ESQ, 40 Kontakt(e), 2.54 mm, Durchsteckmontage tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Ausführung: Buchse Steckverbindermontage: Durchsteckmontage Anzahl der Kontakte: 40Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Steckverbinder: Buchsenleiste Stapelhöhe: 2.54mm Produktpalette: ESQ Series productTraceability: No Kontaktanschluss: Lötanschluss usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm |
auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| ESQ-120-33-L-D |
|
Hersteller: Samtec Inc.
Description: CONN SOCKET 40POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.635" (16.13mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 40POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.635" (16.13mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
auf Bestellung 171 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.78 EUR |
| 10+ | 12.34 EUR |
| 25+ | 11.42 EUR |
| 50+ | 10.52 EUR |
| 100+ | 9.32 EUR |
| ESQ-120-33-L-D |
|
Hersteller: SAMTEC
Description: SAMTEC - ESQ-120-33-L-D - Stapelbare Leiterplattensteckverbinder, erhöht, ESQ, 40 Kontakt(e), 2.54 mm, Durchsteckmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Ausführung: Buchse
Steckverbindermontage: Durchsteckmontage
Anzahl der Kontakte: 40Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Buchsenleiste
Stapelhöhe: 2.54mm
Produktpalette: ESQ Series
productTraceability: No
Kontaktanschluss: Lötanschluss
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
Description: SAMTEC - ESQ-120-33-L-D - Stapelbare Leiterplattensteckverbinder, erhöht, ESQ, 40 Kontakt(e), 2.54 mm, Durchsteckmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Ausführung: Buchse
Steckverbindermontage: Durchsteckmontage
Anzahl der Kontakte: 40Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Buchsenleiste
Stapelhöhe: 2.54mm
Produktpalette: ESQ Series
productTraceability: No
Kontaktanschluss: Lötanschluss
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)