ESQT-106-02-M-Q-770 Samtec
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 10.1 EUR |
| 10+ | 9.22 EUR |
| 25+ | 8.27 EUR |
| 50+ | 7.34 EUR |
| 100+ | 6.95 EUR |
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Technische Details ESQT-106-02-M-Q-770 Samtec
Description: CONN SOCKET 24POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 24, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.080" (2.03mm), Insulation Height: 0.770" (19.56mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 4.
Weitere Produktangebote ESQT-106-02-M-Q-770 nach Preis ab 8.98 EUR bis 10.58 EUR
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ESQT-106-02-M-Q-770 | Hersteller : Samtec Inc. |
 Description: CONN SOCKET 24POS 0.079 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 24 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.080" (2.03mm) Insulation Height: 0.770" (19.56mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 4 |
auf Bestellung 98 Stücke: Lieferzeit 10-14 Tag (e) |
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