Technische Details ESQT-107-02-M-Q-745 Samtec
Description: CONN SOCKET 28POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 28, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Contact Length - Post: 0.105" (2.67mm), Insulation Height: 0.745" (18.92mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 4.
Weitere Produktangebote ESQT-107-02-M-Q-745
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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ESQT-107-02-M-Q-745 | Hersteller : Samtec |
 Conn Elevated Socket SKT 28 POS 2mm Solder ST Top Entry Thru-Hole Layer |
Produkt ist nicht verfügbar |
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| ESQT-107-02-M-Q-745 | Hersteller : Samtec Inc. |
Description: CONN SOCKET 28POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 28 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Contact Length - Post: 0.105" (2.67mm) Insulation Height: 0.745" (18.92mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 4 |
Produkt ist nicht verfügbar |
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ESQT-107-02-M-Q-745 | Hersteller : Samtec |
Headers & Wire Housings FleXYZ Flexible-Height Socket Strip, 2.00mm Pitch |
Produkt ist nicht verfügbar |